Engineers Create the First Double-Sided 10-Layer PCB Utilizing 3D Printing

This week, HENSOLDT introduced that utilizing a newly-developed dielectric polymer and conductive inks from Nano Dimension, the corporate has efficiently assembled the primary 10-layer printed circuit board (PCB) mounting digital elements on either side of the board.


10-layer circuit board

HENSOLDT’s 10-layer PCB is populated on either side. Picture used courtesy of HENSOLDT

This the primary time that a 3D-printed board has been capable of stand as much as the robust soldering course of that dual-sided boards require. 


The Potentialities of Additive Manufacturing and 3D Printing

Constructing a multi-layer PCB is an costly, time-consuming prospect. However, till a producer produces such a board, the product is only a dream that solely exists within the reminiscence cells of a simulator. What’s wanted is a quick, cheap option to provide you with a real-world, bodily prototype.

Enter additive manufacturing. 

A fancy board will be generated at a comparatively low expense—and in a day, not weeks. Within the improvement stage, few issues are extra irritating than kludging a board to mirror a modified design. 

With the quick turnaround enabled by additive manufacturing, an up-to-the-minute board is rapidly made accessible. Moreover, for low-run merchandise, utilizing PC printing can serve the entire product cycle, and engineering modifications will be simply accommodated at vastly decreased time and expense for fast-evolving gadgets.

Lastly, additive manufacturing is usually a nice assist in impedance management, which requires exact fabrication of PCB interconnects.


The interconnect architecture in a 3D-printed circuit board (left) looks similar to the architecture in an IC (right)

The interconnect structure in a 3D-printed circuit board (left) seems just like the structure in an IC (proper), eliminating using normal vias. Picture used courtesy of Nano Dimension

As described by Nano Dimensions, using 3D printing for PCBs fabrication permits designers to transcend the usual hint geometries accessible with normal planar manufacturing processes, guaranteeing tight impedance management.


HENSOLDT and Nano Dimension’s Lengthy-Time period Partnership

As we beforehand reported, HENSOLDT has been using Nano Dimension’s Dragonfly expertise for 3D printing. 


The DragonFly LDM.

The DragonFly LDM. Picture used courtesy of Nano Dimensions


This additive manufacturing platform integrates an inkjet deposition printer with its personal nano-inks and 3D software program. The unit prints digital circuits resembling antennas, capacitors, PCBs, and sensors.


The DragonFly LDM features two printheads

The DragonFly LDM options two printheads, one for dielectric polymer ink and the opposite for nano-Silver conductive ink. Picture used courtesy of Nano Dimensions


The twin printhead association permits the DragonFly LDM to concurrently print with each dielectric polymer ink and conductive ink in a single print job, hastening the time to completion.


Nano Dimension’s Conducting and Polymer Inks

Nano Dimensions gives each conducting and polymer inks, together with its AgCite Nanoparticle Silver Ink and its Dielectric Nanoparticle Polymer Ink. 

AgCite Nanoparticle Silver Ink. Silver particles of 10 to 100 nanometers in measurement are managed for form and particle dispersion, enabling the ink to be optimized for functions resembling RFID and OLED elements whereas sustaining glorious conductivity, adhesion, and suppleness.


Nano-inks are customized for additive manufacturing.

Nano Dimensions gives nano-inks which can be personalized for additive manufacturing. Picture used courtesy of Nano Dimensions


Dielectric Nanoparticle Polymer Ink. Polymer inks are designed to enhance the conductive silver inks and may accommodate width tolerances all the way down to tons of of microns. To dwell as much as the challenges of multilayer PCB printing, necessary properties in adhesion, thermal dissipation, and flammability have been designed in.


3D Manufacturing: Greatest for Prototyping and Quick Runs

Producers resembling HENSOLDT can use additive manufacturing to nice benefit. HENSOLDT’s CEO Thomas Müller explains, “Navy sensor options require efficiency and reliability ranges far above these of economic elements. To have high-density elements rapidly accessible with decreased effort by the use of 3D printing offers us a aggressive edge within the improvement means of such high-end digital methods.” 

Whereas many observers mistakenly tout 3D manufacturing as a option to mass manufacture easy merchandise, the actual way forward for the expertise appears to lie in prototyping and short-run gadgets. And for producers like HENSOLDT who want the very tightest management, the expertise might show to be a game-changer.



Have you ever ever toyed with 3D printing in circuit board design? Share your experiences within the feedback under.

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